North America Advanced Packaging Market 2022-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity
- Report ID: 29774
- Date: Jun, 2022
- Pages: 89
- Category: Chemicals & Materials
North America advanced packaging market is projected to grow by 8.1% annually in the forecast period and reach $8,293.6 million by 2031, driven by the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging.
Highlighted with 20 tables and 38 figures, this 89-page report “North America Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire North America advanced packaging market and all its sub-segments through extensively detailed classifications.
Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year.
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify North America advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Country.
Based on Product Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Active Packaging
• Smart and Intelligent Packaging
Based on Packaging Platform, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 2.5D/3D Integrated Circuit
• Fan Out Wafer Level Package (Fo-WLP)
• Embedded Die
• Fan In Wafer Level Package (Fi-WLP)
• Other Packaging Platforms
By End User, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• IT and Telecom
• Automotive and Transportation
• Industrial Sector
• Healthcare and Life Science
• Aerospace and Defense
• Other End Users
Geographically, the following national/local markets are fully investigated:
• U.S.
• Canada
• Mexico
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of the regional market by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Advanced Semiconductor Engineering Inc.
Amkor Technology, Inc.
Brewer Science, Inc.
Chipbond Technology Corporation
Intel Corporation
International Business Machines Corporation (IBM)
Microchip Technology, Inc.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
STATS ChipPAC Pte. Ltd
SÜSS Microtec Se
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments, Inc.
Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 6
1.1 Industry Definition and Research Scope 6
1.1.1 Industry Definition 6
1.1.2 Research Scope 7
1.2 Research Methodology 10
1.2.1 Overview of Market Research Methodology 10
1.2.2 Market Assumption 11
1.2.3 Secondary Data 11
1.2.4 Primary Data 11
1.2.5 Data Filtration and Model Design 12
1.2.6 Market Size/Share Estimation 13
1.2.7 Research Limitations 14
1.3 Executive Summary 15
2 Market Overview and Dynamics 17
2.1 Market Size and Forecast 17
2.1.1 Impact of COVID-19 on World Economy 18
2.1.2 Impact of COVID-19 on the Market 20
2.2 Major Growth Drivers 22
2.3 Market Restraints and Challenges 25
2.4 Emerging Opportunities and Market Trends 28
2.5 Porter’s Fiver Forces Analysis 32
3 Segmentation of North America Market by Product Type 36
3.1 Market Overview by Product Type 36
3.2 Active Packaging 38
3.3 Smart and Intelligent Packaging 39
4 Segmentation of North America Market by Packaging Platform 40
4.1 Market Overview by Packaging Platform 40
4.2 Flip-Chip Ball Grid Array 42
4.3 Flip Chip CSP 43
4.4 Wafer Level CSP 44
4.5 2.5D/3D Integrated Circuit 45
4.6 Fan Out Wafer Level Package (Fo-WLP) 46
4.7 Embedded Die 47
4.8 Fan In Wafer Level Package (Fi-WLP) 48
4.9 Other Packaging Platforms 49
5 Segmentation of North America Market by End User 50
5.1 Market Overview by End User 50
5.2 Consumer Electronics 52
5.3 IT and Telecom 53
5.4 Automotive and Transportation 54
5.5 Industrial Sector 55
5.6 Healthcare and Life Science 56
5.7 Aerospace and Defense 57
5.8 Other End Users 58
6 North America Market 2021-2031 by Country 59
6.1 Overview of North America Market 59
6.2 U.S. 62
6.3 Canada 65
6.4 Mexico 67
7 Competitive Landscape 69
7.1 Overview of Key Vendors 69
7.2 New Product Launch, Partnership, Investment, and M&A 72
7.3 Company Profiles 73
Advanced Semiconductor Engineering Inc. 73
Amkor Technology, Inc. 75
Brewer Science, Inc. 76
Chipbond Technology Corporation 77
Intel Corporation 78
International Business Machines Corporation (IBM) 79
Microchip Technology, Inc. 80
Qualcomm Technologies, Inc. 81
Renesas Electronics Corporation 82
Samsung Electronics Co., Ltd. 83
STATS ChipPAC Pte. Ltd 84
SÜSS Microtec Se 85
Taiwan Semiconductor Manufacturing Company, Limited 86
Texas Instruments, Inc. 87
Universal Instruments Corporation 88
RELATED REPORTS 89
List of Tables
Table 1. Snapshot of North America Advanced Packaging Market in Balanced Perspective, 2021-2031 16
Table 2. World Economic Outlook, 2021-2031 19
Table 3. World Electrical and Electronics Market, 2021-2031, $ bn 24
Table 4. Main Product Trends and Market Opportunities in North America Advanced Packaging Market 28
Table 5. North America Advanced Packaging Market by Product Type, 2021-2031, $ mn 36
Table 6. North America Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 40
Table 7. North America Advanced Packaging Market by End User, 2021-2031, $ mn 50
Table 8. North America Advanced Packaging Market by Country, 2021-2031, $ mn 60
Table 9. U.S. Advanced Packaging Market by Product Type, 2021-2031, $ mn 64
Table 10. U.S. Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 64
Table 11. U.S. Advanced Packaging Market by End User, 2021-2031, $ mn 64
Table 12. Canada Advanced Packaging Market by Product Type, 2021-2031, $ mn 66
Table 13. Canada Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 66
Table 14. Canada Advanced Packaging Market by End User, 2021-2031, $ mn 66
Table 15. Mexico Advanced Packaging Market by Product Type, 2021-2031, $ mn 68
Table 16. Mexico Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 68
Table 17. Mexico Advanced Packaging Market by End User, 2021-2031, $ mn 68
Table 18. Advanced Semiconductor Engineering Inc.: Company Snapshot 73
Table 19. Advanced Semiconductor Engineering Inc.: Business Segmentation 74
Table 20. Advanced Semiconductor Engineering Inc.: Product Portfolio 74
List of Figures
Figure 1. Research Method Flow Chart 10
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation 13
Figure 3. North America Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031 15
Figure 4. North America Advanced Packaging Market, 2021-2031, $ mn 17
Figure 5. Impact of COVID-19 on Business 20
Figure 6. Primary Drivers and Impact Factors of North America Advanced Packaging Market 22
Figure 7. Primary Restraints and Impact Factors of North America Advanced Packaging Market 25
Figure 8. Investment Opportunity Analysis 29
Figure 9. Porter’s Fiver Forces Analysis of North America Advanced Packaging Market 32
Figure 10. Breakdown of North America Advanced Packaging Market by Product Type, 2021-2031, % of Revenue 37
Figure 11. North America Addressable Market Cap in 2022-2031 by Product Type, Value ($ mn) and Share (%) 37
Figure 12. North America Advanced Packaging Market by Product Type: Active Packaging, 2021-2031, $ mn 38
Figure 13. North America Advanced Packaging Market by Product Type: Smart and Intelligent Packaging, 2021-2031, $ mn 39
Figure 14. Breakdown of North America Advanced Packaging Market by Packaging Platform, 2021-2031, % of Sales Revenue 41
Figure 15. North America Addressable Market Cap in 2022-2031 by Packaging Platform, Value ($ mn) and Share (%) 41
Figure 16. North America Advanced Packaging Market by Packaging Platform: Flip-Chip Ball Grid Array, 2021-2031, $ mn 42
Figure 17. North America Advanced Packaging Market by Packaging Platform: Flip Chip CSP, 2021-2031, $ mn 43
Figure 18. North America Advanced Packaging Market by Packaging Platform: Wafer Level CSP, 2021-2031, $ mn 44
Figure 19. North America Advanced Packaging Market by Packaging Platform: 2.5D/3D Integrated Circuit, 2021-2031, $ mn 45
Figure 20. North America Advanced Packaging Market by Packaging Platform: Fan Out Wafer Level Package (Fo-WLP), 2021-2031, $ mn 46
Figure 21. North America Advanced Packaging Market by Packaging Platform: Embedded Die, 2021-2031, $ mn 47
Figure 22. North America Advanced Packaging Market by Packaging Platform: Fan In Wafer Level Package (Fi-WLP), 2021-2031, $ mn 48
Figure 23. North America Advanced Packaging Market by Packaging Platform: Other Packaging Platforms, 2021-2031, $ mn 49
Figure 24. Breakdown of North America Advanced Packaging Market by End User, 2021-2031, % of Sales Revenue 51
Figure 25. North America Addressable Market Cap in 2022-2031 by End User, Value ($ mn) and Share (%) 51
Figure 26. North America Advanced Packaging Market by End User: Consumer Electronics, 2021-2031, $ mn 52
Figure 27. North America Advanced Packaging Market by End User: IT and Telecom, 2021-2031, $ mn 53
Figure 28. North America Advanced Packaging Market by End User: Automotive and Transportation, 2021-2031, $ mn 54
Figure 29. North America Advanced Packaging Market by End User: Industrial Sector, 2021-2031, $ mn 55
Figure 30. North America Advanced Packaging Market by End User: Healthcare and Life Science, 2021-2031, $ mn 56
Figure 31. North America Advanced Packaging Market by End User: Aerospace and Defense, 2021-2031, $ mn 57
Figure 32. North America Advanced Packaging Market by End User: Other End Users, 2021-2031, $ mn 58
Figure 33. Breakdown of North America Advanced Packaging Market by Country, 2021 and 2031, % of Revenue 60
Figure 34. Contribution to North America 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 61
Figure 35. U.S. Advanced Packaging Market, 2021-2031, $ mn 63
Figure 36. Canada Advanced Packaging Market, 2021-2031, $ mn 65
Figure 37. Advanced Packaging Market in Mexico, 2021-2031, $ mn 67
Figure 38. Growth Stage of North America Advanced Packaging Industry over the Forecast Period 69
Research methodology is mainly referring to the practical how of any offered piece of research. More specifically, it’s all about how a researcher systematically designs a study in order to assure extremely valid as well as reliable results that ultimately address the targets and objectives of the research.
In any formal research including academic journal, article, dissertation and so on, there will be a special section on a research methodology that mainly describes what, by whom, how to gather as well as how to evaluate the data are provided.
This research methodology has been segmented into following types:
Primary Research:
It is said to be original information that the researchers collect for the crucial purposes of answering the research questions of readers with the help of surveys, observations and experiments.
Secondary Research:
The secondary research is the data that has already been collected by various other researchers in the form of government analysis or scientific studies.
Qualitative Research:
It is descriptive and subjective method irrespective of facts. Both observation and description are essential in this type of research methodology. Its main vision is to analyze knowledge, attitudes, behaviours as well as opinions of people related to the topic of any research. This method has been operated through grounded research, case study and actionable research.
Quantitative Research:
It contains several laboratory experiments, basic surveys, mathematical calculations, simulations and so on. The possible measurement, quantity or amount is considered to be a major factor in the quantitative research methodology.
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