Europe Advanced IC Substrates Market 2023-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity
- Report ID: 57555
- Date: May, 2023
- Pages: 110
- Category: ICT & Media
Europe advanced IC substrates market was valued at $540.8 million in 2021 and will grow by 5.3% annually over 2023-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 33 tables and 50 figures, this 110-page report “Europe Advanced IC Substrates Market 2023-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity.” is based on a comprehensive research of the entire Europe advanced IC substrates market and all its sub-segments through extensively detailed classifications.
Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2023 till 2031 with 2022 as the base year.
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Europe advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country.
Based on Packaging Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2023-2031 included in each section.
• FC BGA
• FC CSP
• Other Packaging Types
Based on Material Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2023-2031 included in each section.
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate
By Manufacturing Method, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2023-2031 included in each section.
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)
By Bonding Technology, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2023-2031 included in each section.
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)
By Application, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2023-2031 included in each section.
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications
Geographically, the following national/local markets are fully investigated:
• Germany
• UK
• France
• Spain
• Italy
• Netherlands
• Rest of Europe (further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2023-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd.
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 7
1.1 Industry Definition and Research Scope 7
1.1.1 Industry Definition 7
1.1.2 Research Scope 8
1.2 Research Methodology 11
1.2.1 Overview of Market Research Methodology 11
1.2.2 Market Assumption 12
1.2.3 Secondary Data 12
1.2.4 Primary Data 12
1.2.5 Data Filtration and Model Design 13
1.2.6 Market Size/Share Estimation 14
1.2.7 Research Limitations 15
1.3 Executive Summary 16
2 Market Overview and Dynamics 19
2.1 Market Size and Forecast 19
2.1.1 Impact of COVID-19 on World Economy 20
2.1.2 Impact of COVID-19 on the Market 25
2.2 Major Growth Drivers 27
2.3 Market Restraints and Challenges 32
2.4 Emerging Opportunities and Market Trends 35
2.5 Porter’s Fiver Forces Analysis 39
3 Segmentation of Europe Market by Packaging Type 43
3.1 Market Overview by Packaging Type 43
3.2 FC BGA 45
3.3 FC CSP 46
3.4 Other Packaging Types 47
4 Segmentation of Europe Market by Material Type 48
4.1 Market Overview by Material Type 48
4.2 Rigid Integrated Circuit Substrate 50
4.3 Flex Integrated Circuit Substrate 51
4.4 Ceramic Integrated Circuit Substrate 52
5 Segmentation of Europe Market by Manufacturing Method 53
5.1 Market Overview by Manufacturing Method 53
5.2 Subtraction Process (SP) 55
5.3 Addition Process (AP) 56
5.4 Modified Semi-additive Process (MSAP) 57
6 Segmentation of Europe Market by Bonding Technology 58
6.1 Market Overview by Bonding Technology 58
6.2 Wire Bonding 60
6.3 FC Bonding 62
6.4 Tape Automated Bonding (TAB) 64
7 Segmentation of Europe Market by Application 65
7.1 Market Overview by Application 65
7.2 Mobile and Consumer Electronics 67
7.3 Automotive and Transportation 68
7.4 IT and Telecom 69
7.5 Other Applications 70
8 European Market 2021-2031 by Country 71
8.1 Overview of European Market 71
8.2 Germany 74
8.3 U.K. 76
8.4 France 78
8.5 Spain 80
8.6 Italy 82
8.7 Netherlands 84
8.8 Rest of European Market 86
9 Competitive Landscape 88
9.1 Overview of Key Vendors 88
9.2 New Product Launch, Partnership, Investment, and M&A 91
9.3 Company Profiles 92
ASE Group 92
AT&S Austria Technologie & Systemtechnik AG 94
Fujitsu Ltd. 95
IBIDEN Co., Ltd. 96
Kinsus Interconnect Technology Corp. 97
Korea Circuit Co., Ltd. 98
KYOCERA Corporation 99
LG Innotek Co., Ltd. 100
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 101
Shenzhen Fastprint Circuit Tech 102
Shinko Electric Industries Co., Ltd. 103
Siliconware Precision Industries Co., Ltd. 104
STATS ChipPAC Pte. Ltd. 105
TTM Technologies Inc. 106
Unimicron Corporation 107
Zhen Ding Technology Holding Ltd. 108
Zhuhai ACCESS Semiconductor 109
RELATED REPORTS 110
List of Tables
List of Tables:
Table 1. Snapshot of Europe Advanced IC Substrates Market in Balanced Perspective, 2021-2031 17
Table 2. World Economic Outlook, 2021-2031 22
Table 3. World Economic Outlook, 2021-2023 23
Table 4. World Semiconductor Market, 2021-2031, $ bn 30
Table 5. Main Product Trends and Market Opportunities in Europe Advanced IC Substrates Market 35
Table 6. Europe Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 43
Table 7. Europe Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 48
Table 8. Europe Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn 53
Table 9. Europe Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn 58
Table 10. Europe Advanced IC Substrates Market by Application, 2021-2031, $ mn 65
Table 11. Europe Advanced IC Substrates Market by Country, 2021-2031, $ mn 73
Table 12. Germany Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 75
Table 13. Germany Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 75
Table 14. Germany Advanced IC Substrates Market by Application, 2021-2031, $ mn 75
Table 15. U.K. Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 77
Table 16. U.K. Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 77
Table 17. U.K. Advanced IC Substrates Market by Application, 2021-2031, $ mn 77
Table 18. France Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 79
Table 19. France Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 79
Table 20. France Advanced IC Substrates Market by Application, 2021-2031, $ mn 79
Table 21. Spain Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 81
Table 22. Spain Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 81
Table 23. Spain Advanced IC Substrates Market by Application, 2021-2031, $ mn 81
Table 24. Italy Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 83
Table 25. Italy Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 83
Table 26. Italy Advanced IC Substrates Market by Application, 2021-2031, $ mn 83
Table 27. Netherlands Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 85
Table 28. Netherlands Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 85
Table 29. Netherlands Advanced IC Substrates Market by Application, 2021-2031, $ mn 85
Table 30. Advanced IC Substrates Market in Rest of Europe by Country, 2021-2031, $ mn 87
Table 31. ASE Group: Company Snapshot 92
Table 32. ASE Group: Business Segmentation 93
Table 33. ASE Group: Product Portfolio 93
List of Figures
List of Figures:
Figure 1. Research Method Flow Chart 11
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation 14
Figure 3. Europe Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031 16
Figure 4. Industry Value Chain Analysis 19
Figure 5. Europe Advanced IC Substrates Market, 2021-2031, $ mn 20
Figure 6. Impact of COVID-19 on Business 25
Figure 7. Primary Drivers and Impact Factors of Europe Advanced IC Substrates Market 27
Figure 8. World 5G Devices Market by Value, 2019-2030, $ bn 31
Figure 9. World Autonomous Vehicle Market, 2019-2030, $ mn 31
Figure 10. Primary Restraints and Impact Factors of Europe Advanced IC Substrates Market 32
Figure 11. Investment Opportunity Analysis 36
Figure 12. Porter’s Fiver Forces Analysis of Europe Advanced IC Substrates Market 39
Figure 13. Breakdown of Europe Advanced IC Substrates Market by Packaging Type, 2021-2031, % of Revenue 44
Figure 14. Europe Addressable Market Cap in 2022-2031 by Packaging Type, Value ($ mn) and Share (%) 44
Figure 15. Europe Advanced IC Substrates Market by Packaging Type: FC BGA, 2021-2031, $ mn 45
Figure 16. Europe Advanced IC Substrates Market by Packaging Type: FC CSP, 2021-2031, $ mn 46
Figure 17. Europe Advanced IC Substrates Market by Packaging Type: Other Packaging Types, 2021-2031, $ mn 47
Figure 18. Breakdown of Europe Advanced IC Substrates Market by Material Type, 2021-2031, % of Sales Revenue 49
Figure 19. Europe Addressable Market Cap in 2022-2031 by Material Type, Value ($ mn) and Share (%) 49
Figure 20. Europe Advanced IC Substrates Market by Material Type: Rigid Integrated Circuit Substrate, 2021-2031, $ mn 50
Figure 21. Europe Advanced IC Substrates Market by Material Type: Flex Integrated Circuit Substrate, 2021-2031, $ mn 51
Figure 22. Europe Advanced IC Substrates Market by Material Type: Ceramic Integrated Circuit Substrate, 2021-2031, $ mn 52
Figure 23. Breakdown of Europe Advanced IC Substrates Market by Manufacturing Method, 2021-2031, % of Sales Revenue 54
Figure 24. Europe Addressable Market Cap in 2022-2031 by Manufacturing Method, Value ($ mn) and Share (%) 54
Figure 25. Europe Advanced IC Substrates Market by Manufacturing Method: Subtraction Process (SP), 2021-2031, $ mn 55
Figure 26. Europe Advanced IC Substrates Market by Manufacturing Method: Addition Process (AP), 2021-2031, $ mn 56
Figure 27. Europe Advanced IC Substrates Market by Manufacturing Method: Modified Semi-additive Process (MSAP), 2021-2031, $ mn 57
Figure 28. Breakdown of Europe Advanced IC Substrates Market by Bonding Technology, 2021-2031, % of Revenue 59
Figure 29. Europe Addressable Market Cap in 2022-2031 by Bonding Technology, Value ($ mn) and Share (%) 59
Figure 30. Europe Advanced IC Substrates Market by Bonding Technology: Wire Bonding, 2021-2031, $ mn 60
Figure 31. Picture of Wire Bonding Illustrated in a DIP Package 61
Figure 32. Europe Advanced IC Substrates Market by Bonding Technology: FC Bonding, 2021-2031, $ mn 62
Figure 33. Picture of a Flipped Chip (IC) on a Passive Substrate 63
Figure 34. Europe Advanced IC Substrates Market by Bonding Technology: Tape Automated Bonding (TAB), 2021-2031, $ mn 64
Figure 35. Breakdown of Europe Advanced IC Substrates Market by Application, 2021-2031, % of Revenue 66
Figure 36. Europe Addressable Market Cap in 2022-2031 by Application, Value ($ mn) and Share (%) 66
Figure 37. Europe Advanced IC Substrates Market by Application: Mobile and Consumer Electronics, 2021-2031, $ mn 67
Figure 38. Europe Advanced IC Substrates Market by Application: Automotive and Transportation, 2021-2031, $ mn 68
Figure 39. Europe Advanced IC Substrates Market by Application: IT and Telecom, 2021-2031, $ mn 69
Figure 40. Europe Advanced IC Substrates Market by Application: Other Applications, 2021-2031, $ mn 70
Figure 41. Breakdown of European Advanced IC Substrates Market by Country, 2021 and 2031, % of Revenue 72
Figure 42. Contribution to Europe 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 73
Figure 43. Advanced IC Substrates Market in Germany, 2021-2031, $ mn 74
Figure 44. Advanced IC Substrates Market in U.K., 2021-2031, $ mn 76
Figure 45. Advanced IC Substrates Market in France, 2021-2031, $ mn 78
Figure 46. Advanced IC Substrates Market in Spain, 2021-2031, $ mn 80
Figure 47. Advanced IC Substrates Market in Italy, 2021-2031, $ mn 82
Figure 48. Advanced IC Substrates Market in Netherlands, 2021-2031, $ mn 84
Figure 49. Advanced IC Substrates Market in Rest of Europe, 2021-2031, $ mn 86
Figure 50. Growth Stage of Europe Advanced IC Substrates Industry over the Forecast Period 88
Research methodology is mainly referring to the practical how of any offered piece of research. More specifically, it’s all about how a researcher systematically designs a study in order to assure extremely valid as well as reliable results that ultimately address the targets and objectives of the research.
In any formal research including academic journal, article, dissertation and so on, there will be a special section on a research methodology that mainly describes what, by whom, how to gather as well as how to evaluate the data are provided.
This research methodology has been segmented into following types:
Primary Research:
It is said to be original information that the researchers collect for the crucial purposes of answering the research questions of readers with the help of surveys, observations and experiments.
Secondary Research:
The secondary research is the data that has already been collected by various other researchers in the form of government analysis or scientific studies.
Qualitative Research:
It is descriptive and subjective method irrespective of facts. Both observation and description are essential in this type of research methodology. Its main vision is to analyze knowledge, attitudes, behaviours as well as opinions of people related to the topic of any research. This method has been operated through grounded research, case study and actionable research.
Quantitative Research:
It contains several laboratory experiments, basic surveys, mathematical calculations, simulations and so on. The possible measurement, quantity or amount is considered to be a major factor in the quantitative research methodology.
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