Bonding wire is the material of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
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Bone conduction technology is first introduced for hearing aid and military communication purpose. As sound can be conducted to the inner ear through the bone of the skull. This means that the...Read more...
Bone Harvester is intended to harvest cancellous bone and marrow.
Global Bone Harvester Market research report 2022-2030 will provide an outline of the industry potential, demographics a...Read more...
Bone morphogenetic proteins (BMPs) are naturally occurring proteins found in the human body. This family of proteins is involved in a myriad of cellular responses. Certain BMPs are osteoinducti...Read more...
Booster Pump is a machine used to increase the pressure of the fluid, which is usually used in the areas where the normal system is low and needs to be increased. This pump is designed for boos...Read more...
BOPP Synthetic Paper is Biaxial Oriented Polypropylene Synthetic Paper. There are two type of Synthetic Paper: BOPP and HDPE.Synthetic paper, from its early development and historical evolution...Read more...
Boron can be prepared in several crystalline and amorphous forms. Well known crystalline forms are α-rhombohedral, β-rhombohedral, and β-tetragonal. In special circumstances, boron can also be...Read more...
Boron Carbide is one of the hardest materials known, ranking third behind diamond and cubic boron nitride. Boron carbide powder is mainly produced by reacting carbon with B2O3 in an electric ar...Read more...
Boron was named for the mineral borax, thought to come from the Persian name burah for that mineral. Boron minerals, mainly borax, were traded over a thousand years ago, when sheep, camel and y...Read more...
Borosilicate glass is a type of glass with the main glass-forming constituents of silica and boron trioxide. Borosilicate glasses are known for having very low coefficients of thermal expansion...Read more...